Plastic and nonmetallic article shaping or treating: processes – Direct application of electrical or wave energy to heat the...
Reexamination Certificate
2011-07-05
2011-07-05
Wyrozebski, Kat (Department: 1746)
Plastic and nonmetallic article shaping or treating: processes
Direct application of electrical or wave energy to heat the...
C264S405000, C264S494000, C264S496000
Reexamination Certificate
active
07972553
ABSTRACT:
Method for transferring a pattern from a template (10) having a structured surface (11) to a substrate (12) carrying a surface layer (14) of a material devised to 5 solidify upon exposure to radiation, comprising: arranging said template and substrate mutually parallel in an imprint apparatus, with said structured surface facing said surface layer; heating the template and the substrate to a temperature Tpby means of a heater device (20); and while maintaining said temperature Tp, performing the steps of: pressing the template towards the substrate for imprinting said pattern into said layer; exposing said layer to radiation (19) for solidifying the layer, and—postbaking the layer.
REFERENCES:
patent: 4233261 (1980-11-01), Mijnheer
patent: 4312823 (1982-01-01), Kraakman et al.
patent: 4360266 (1982-11-01), Takeuchi
patent: 4844947 (1989-07-01), Kasner et al.
patent: 5804017 (1998-09-01), Hector
patent: 5866281 (1999-02-01), Guckel et al.
patent: 5947027 (1999-09-01), Burgin et al.
patent: 6027630 (2000-02-01), Cohen
patent: 6190929 (2001-02-01), Wang et al.
patent: 6284345 (2001-09-01), Ruoff
patent: 6334960 (2002-01-01), Willson et al.
patent: 6387787 (2002-05-01), Mancini et al.
patent: 6482742 (2002-11-01), Chou
patent: 6743740 (2004-06-01), Brask
patent: 6949199 (2005-09-01), Gauzner et al.
patent: 7144539 (2006-12-01), Olsson
patent: 7374864 (2008-05-01), Guo et al.
patent: 2003/0071016 (2003-04-01), Shih et al.
patent: 2003/0159608 (2003-08-01), Heidari
patent: 2003/0189273 (2003-10-01), Olsson
patent: 2004/0021254 (2004-02-01), Sreenivasan et al.
patent: 2004/0079730 (2004-04-01), Ahrens et al.
patent: 2004/0110856 (2004-06-01), Young et al.
patent: 2004/0131718 (2004-07-01), Chou et al.
patent: 2005/0158419 (2005-07-01), Watts et al.
patent: 2005/0202350 (2005-09-01), Colburn et al.
patent: 1478642 (2004-03-01), None
patent: 36 43817 (1988-06-01), None
patent: 2-289311 (1990-11-01), None
patent: 02289311 (1990-11-01), None
patent: 11191240 (1999-07-01), None
patent: 2000-194142 (2000-07-01), None
patent: 2003-77867 (2003-03-01), None
patent: 2003-077867 (2003-03-01), None
patent: 2003-516644 (2003-05-01), None
patent: 2003-272998 (2003-09-01), None
patent: WO 01/33300 (2001-05-01), None
patent: WO 01/42858 (2001-06-01), None
patent: 02/07199 (2002-01-01), None
patent: WO 02/07199 (2002-01-01), None
patent: WO 02/067055 (2002-08-01), None
patent: WO 03/005124 (2003-01-01), None
patent: 03/073164 (2003-09-01), None
Pfeiffer et al., Multistep profiles by mix and match of nanoimprint and UV lithography, Microelectric Engineering, vol. 57-58 (2001), pp. 381-387.
Resnick D. J. et al., “Imprint Lithography for Integrated Circuit Fabrication”, Journal of Vaccum Science & Technology, American Vacuum Society, vol. 21, No. 6, pp. 2624-2631, (2003).
Wissen et al., “UV Curing of Resists for Warm Embossing”, Elsevier B.V., Microelectronic Engineering, vol. 73-74, pp. 184-187, (2004).
Reano et al., “Stability of Functional Polymers After Plasticizer-Assisted Imprint Lithography”, Journal of Vaccum Science & Technology, American Vacuum Society, vol. 22, No. 6, pp. 3294-3299, (2004).
Bender et al., “Fabrication of Nanostructures Using a UV-Based Imprint Technique”, Elsevier B.V., Microelectronic Engineering, vol. 53, pp. 233-236, (2000).
Heidari et al.; “Large Scale Nanolithography Using Nanoimprint Lithography”; Journal of Vacuum Science & Technology B, vol. 17, No. 6, pp. 2961-2964, (1999).
English language version of “Notification of the First Office Action” in corresponding Chinese App. No. 200510081756.4, Notification Date Jun. 6, 2008.
English language version of “Notification of the Second Office Action” in corresponding Chinese App. No. 200510081756.4, Notification Date Oct. 7, 2009.
Office Action in U.S. Appl. No. 10/581,497, Date Nov. 25, 2009 (16 pages).
Office Action in U.S. Appl. No. 11/123,087, Date Feb. 3, 2009 (11 pages).
Office Action in U.S. Appl. No. 11/123,087, Date Jun. 27, 2008 (8 pages).
Office Action in U.S. Appl. No. 11/123,087, Date Oct. 10, 2007 (9 pages).
Office Action in U.S. Appl. No. 11/905,036, Date Jun. 9, 2009 (13 pages).
Office Action in corresponding U.S. Appl. No. 11/905,036 mailed Dec. 29, 2009 (16 pages).
Office Action in corresponding U.S. Appl. No. 10/581,497 mailed May 4, 2010 (17 pages).
Official Action from corresponding European Application No. 04 445 057.5 dated Oct. 25, 2010.
Office Action in corresponding Japanese Patent Application No. 2005-136511 mailed Jul. 30, 2010 and English translation.
Office Action in corresponding U.S. Appl. No. 10/581,497 mailed Mar. 24, 2011 (14 pages).
Beck Marc
Bolmsjö Erik
Heidari Babak
Theander Erik
Dodds Scott W
Obducat AB
Renner , Otto, Boisselle & Sklar, LLP
Wyrozebski Kat
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