Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate
2005-02-22
2005-02-22
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Incorporating resilient component
C438S124000, C438S126000, C438S617000
Reexamination Certificate
active
06858472
ABSTRACT:
A semiconductor device in a computer system is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon at least some of which are connected to the integrated circuitry and having at least one electrically conductive wire bond made between first and second bond pads of the plurality of bond pads for providing external electrical connection between the two bond pads.
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IBM Technical Disclosure, “Replaceable Engineering Change Pad,” Jan. 1973, pp. 2575-2576.
IBM Technical Disclosure, “Replaceable Engineering Change Pad,” Jan. 1973, pp. 2575-2576.
Brewster William M.
Micro)n Technology, Inc.
TraskBritt
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