Method for immersion plating very thin films of aluminum

Details Method for immersion plating very thin films of aluminum Method for immersion plating very thin films of aluminum

1979-04-05

1980-11-25

Smith, John D.

Metal treatment

Compositions

Heat treating

156665, 156667, 427 90, 427309, 427328, 427436, C23C 300

Patent

active

042356482

ABSTRACT:
A method for plating very thin films of aluminum for subsequent electrical contact. The method is particularly suitable for preparation of the thin films of aluminum used in semiconductor integrated circuits for subsequent plating operations or lead bonding processes. The method comprises a removal of surface oxides in a way that does not substantially attack the very thin films of aluminum followed by immersion plating with a metal selected from the group comprising zinc, tin, nickel, silver and copper.

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patent: 3551122 (1970-12-01), Gulla
patent: 3579375 (1971-05-01), Wonilowicz
patent: 3594197 (1971-07-01), Bunevich et al.
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patent: 3672964 (1972-06-01), Bellis
patent: 3726771 (1973-04-01), Coll-Palagoes
patent: 3982055 (1976-09-01), Howard
patent: 4082604 (1978-04-01), Yanez
patent: 4087367 (1978-05-01), Rioult et al.
patent: 4125648 (1978-11-01), Vratny
Hildick, "Forming Low Metal-to-metal Contact Resistance in Multilevel Metallization" IBM TDB, vol. 19, No. 1, p. 20, 1971.

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