Method for identifying molding compound using an acoustic micros

Details Method for identifying molding compound using an acoustic micros Method for identifying molding compound using an acoustic micros

1996-03-07

1997-05-20

Chapman, John E.

Measuring and testing

Vibration

By mechanical waves

73597, 73599, G01N 2918, G01N 2920

Patent

active

056314256

ABSTRACT:
A non-destructive method of identifying a type of molding compound in a sample using an acoustic microscope, particularly, identifying the type of molding compound used in an integrated circuit package by comparing attributes of the tested molding compound with known attributes of standard molding compounds to identify the molding compound being evaluated. The attributes that are compared include voltage, attenuation, peak frequency, average frequency, and the velocity of reflected sound.

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T.M. Moore, "SAM Provides Critical IC Inspection", Tech Spotlight, reprinted from the Oct. 1990 issue of Advanced Materials & Processes. (3 pages).
(author unknown), "What is an Acoustic Microscope?", [additional information unknown], published prior to Mar. 7, 1996. (6 pages).
J. Siettmann, et al., "Acoustic Evaluation of Electronic Plastic Packages", pp. 309-314, IEEE International Reliability Physics Symposium, (1992).
S.R. Martell, et al., "Nondestructive Evaluation of Microelectronic Components by Acoustic Microscope", SONOSCAN, Inc., Bensenville, IL, published prior to Mar. 7, 1996. (16 pages).

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