Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1998-08-20
2000-06-06
Bowers, Charles
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438117, 257697, 257727, 361760, 361769, H01L 2144, H01L 2148, H01L 2150, H01L 2348, H05K 118
Patent
active
060717564
ABSTRACT:
A method for fabricating a printed-circuit board includes the steps of loading components onto the printed circuit board, and placing a pin array over the components. Each pin is free to move "downward," and each component has at least one pin pressing on it to hold the component in place. Each component also preferably has a pin on each side of it, to hold it against lateral movement. The pin support arrangement is dimensioned so that a gap or space exists between the support and the component side of the board. Heat is applied to the gap, and flows through the interstices between the pins to heat the solder on the upper side of the board to fuse the solder and make the desired connections.
REFERENCES:
patent: 4953061 (1990-08-01), Nitkiewicz
patent: 4982376 (1991-01-01), Megens
patent: 5045976 (1991-09-01), Guilleminot
patent: 5046243 (1991-09-01), Walker
patent: 5642266 (1997-06-01), McCartney
patent: 5754407 (1998-05-01), Kohno
patent: 5777852 (1998-07-01), Bell
Benedict David Reed
Sines John Colin
Berezny Nema
Bowers Charles
Krauss G. H.
Lockheed Martin Corporation
Meise W. H.
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