Method for holding a strip of conductive lead frames

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29740, 174263, 209328, 209330, 357 75, 437206, 257676, H01R 4300

Patent

active

051828510

ABSTRACT:
A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.

REFERENCES:
patent: 4801561 (1989-01-01), Samkhagowit
patent: 4815593 (1989-03-01), Bond et al.
patent: 4903830 (1990-02-01), Onodera

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