Method for holding a plate-like member

Metal working – Method of mechanical manufacture – Work holding

Patent

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Details

269 21, B25B 1100

Patent

active

050654950

ABSTRACT:
A semiconductor wafer receiving apparatus has a base, a table for supporting a wafer, a receiving member having at least three receiving pins which project from a supporting surface and are concealed under the supporting surface upon vertical movement of the table, and a driving unit for vertically moving the table. The wafer is transferred onto the receiving pins while the receiving pins project, and is held on the table while the receiving pins are concealed.

REFERENCES:
patent: 4530635 (1985-07-01), Engelbrecht et al.
patent: 4535834 (1985-08-01), Turner
patent: 4684113 (1987-08-01), Douglas et al.
patent: 4700488 (1987-10-01), Curti

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