Method for high volume assembly of radio frequency...

Details Method for high volume assembly of radio frequency... Method for high volume assembly of radio frequency...

2006-10-10

2006-10-10

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S602100, C235S488000, C340S398100

Reexamination Certificate

active

07117581

ABSTRACT:
A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.

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