Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-05-18
1996-06-18
Johnstone, Adrienne C.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156250, 156256, 156285, 156286, 1563066, 1563069, 156311, 156312, 264510, 428 73, 428116, B32B 3104, B32B 3118, B32B 3120, C09J 500
Patent
active
055274145
ABSTRACT:
A method for high pressure co-cure molding of lightweight honeycomb core composite articles having ramped surfaces utilizing low total density, stabilized ramped honeycomb cores. The low total density, stabilized ramped honeycomb core is formed by net shaping stabilized honeycomb core material into a ramped honeycomb core, which is prepped for lay-up and co-cure by applying a layer of low areal weight film adhesive to the upper, lower and ramped surfaces thereof. The honeycomb core material is stabilized for the net shaping operation by a layer of the low areal weight film adhesive applied to the upper and lower surfaces of the material in a predetermined picture frame format. Composite prepregs and the ramped honeycomb core are layed-up in a semi-rigid molding assembly including a rigid base member and a complementary semi-rigid mold member having at least one internal rigid reinforcement insert, which is vacuum bagged and disposed in an autoclave. The vacuum bag is evacuated, and the layed-up molding assembly is subjected to a two stage pressure, temperature cycle for high pressure co-cure. The autoclave is pressurized to a dwell pressure, and the temperature is then raised from ambient to a dwell temperature whereupon the autoclave is stabilized for a dwell period. Next, the autoclave pressure is increased to a high pressure, and the temperature is raised to a co-cure temperature whereupon the autoclave is stabilized for a co-cure period to effect curing of the lay-up. After curing is complete, the autoclave is cooled, and then depressurized for removal of the composite molding apparatus.
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Carstensen Thomas A.
Dublinski Alex C.
Ramey Philip J.
Johnstone Adrienne C.
Radke Terrance J.
United Technologies Corporation
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