Method for high precision position measurement of two-dimensiona

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

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250548, 250566, 356375, 356401, G01B 1100

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active

048146269

ABSTRACT:
A method for high precision position measurement of two-dimensional structures such as structures on semiconductor wafers or masks, utilizing a reference mask having a two-dimensional grid, the relative position of the structures relative to the grid being identified by opto-electronic scanning using an image sensor and subsequent image processing. The absolute position of the structures to be measured can then be identified from the position of the grid elements. A reference mask is preferably employed whose grid elements carry a binary coding which can be read and decoded by the image processing means. The coding thereby indicates the position of the grid elements in the grid.

REFERENCES:
patent: 4193687 (1980-03-01), Reekstin et al.
patent: 4592648 (1986-06-01), Tabarelli et al.
patent: 4687980 (1987-08-01), Phillips et al.
"Metrology in Mask Manufacturing", IBM J. Res. Develop, vol. 26, No. 5, Sep. 1982.

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