Method for hermetically sealing electronic devices

Metal working – Piezoelectric device making

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Details

65 42, 65138, 310313R, 310344, H01L 4122

Patent

active

049951491

ABSTRACT:
An electronic device package is made by first making in a stencil member (11) an opening (12) in the shape of a closed loop that surrounds an inner portion (13) of the stencil member. The closed loop is a continuous opening except for a plurality of web members (15), each of which extends across the opening to secure the inner stencil portion to the remainder of the stencil member. A glass slurry (7) is forced through the opening of the stencil member onto a first substrate (18) so as to form on the substrate a substantially closed loop of glass slurry, which is thereafter glazed to form a glass loop (32) bonded to the first substrate. The first substrate is used as cover plate and placed over a second substrate (24) containing an electronic device (23) such that the glass loop surrounds the electronic device and contacts the second substrate along its entire length. The glass is heated sufficiently to soften it and cause it to bond to the second substrate as well as the first substrate. Cooling of the glass loop develops continuous hermetic seals to both first and second substrate, thereby to isolate the electronic device from the external environment.

REFERENCES:
patent: 4507907 (1985-04-01), Wolfson
patent: 4560084 (1985-12-01), Wolfson
patent: 4571921 (1986-02-01), Wolfson
"Surface Acoustic Wave Devices," by M. B. N. Butler, Electronic Engineering, Jun. 1980, pp. 37-44.
E. B. Shand, "Glass-Metal Seals," in Glass Engineering Handbook, edited by The Maple Press Company, York, Pa. (McGraw-Hill Book Company, Inc. 1958) pp. 127-128.
"A New Hall Quartz Package for SAW Devices," by T. E. Parker et al., 39th Annual Frequency Control Symposium, 1985, Raytheon Research Division, Lexington, MA 02173, pp. 519-525.

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