Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2002-06-14
2009-06-30
Chang, Rick K (Department: 3726)
Metal working
Method of mechanical manufacture
Electrical device making
C029S412000, C029S842000, C029S832000, C029S841000, C264S157000, C264S272170, C264S272110, C264S236000, C174S521000, C174S524000, C257S787000, C257S790000, C438S106000, C438S108000, C438S110000, C438S112000
Reexamination Certificate
active
07552532
ABSTRACT:
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.
REFERENCES:
patent: 4323593 (1982-04-01), Tsunashima
patent: 5081563 (1992-01-01), Feng et al.
patent: 5439849 (1995-08-01), McBride et al.
patent: 5455459 (1995-10-01), Fillion et al.
patent: 5776657 (1998-07-01), Schaedeli et al.
patent: 6247229 (2001-06-01), Glenn
patent: 6329739 (2001-12-01), Sawano
patent: 6492194 (2002-12-01), Bureau et al.
patent: 6722030 (2004-04-01), Stelzl et al.
patent: 2001/0009277 (2001-07-01), Gaynes et al.
patent: 3 138 743 (1983-04-01), None
patent: 198 16 309 (1998-12-01), None
patent: 0 967 647 (1999-12-01), None
patent: 1 091 406 (2001-04-01), None
patent: 1 093 159 (2001-04-01), None
patent: 11027088 (1999-01-01), None
patent: 2000004139 (2000-01-01), None
patent: 2001176995 (2001-06-01), None
patent: 99/43084 (1999-08-01), None
Christl Ernst
Feiertag Gregor
Krueger Hans
Stelzl Alois
Chang Rick K
EPCOS AG
Schiff & Hardin LLP
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