Method for hermetically encapsulating a component

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S412000, C029S842000, C029S832000, C029S841000, C264S157000, C264S272170, C264S272110, C264S236000, C174S521000, C174S524000, C257S787000, C257S790000, C438S106000, C438S108000, C438S110000, C438S112000

Reexamination Certificate

active

07552532

ABSTRACT:
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.

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