Method for heating semiconductor wafer by means of application o

Details Method for heating semiconductor wafer by means of application o Method for heating semiconductor wafer by means of application o

1983-10-04

1985-08-13

Envall, Jr., Roy N.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219354, 219405, 118725, F27D 1102, C23C 1308, H05B 100

Patent

active

045352275

ABSTRACT:
When heating a semiconductor wafer by means of application of radiated light, a subsidiary heating device which is arranged in contact with the surface of a circumferential edge or a surface portion lying in the vicinity of the circumferential edge of the semiconductor wafer is employed to additionally heat or to preheat the circumferential portion of the wafer so as to make the temperature of the wafer uniform across the entire surface thereof. Use of such subsidiary heating device is effective to prevent the occurrence of such large "warping" as to impair subsequent treatment and/or processing or the development of "slip line".

REFERENCES:
patent: 3471326 (1969-10-01), Kappelmeyer
patent: 3539759 (1970-11-01), Spiro
patent: 3836751 (1974-09-01), Anderson
patent: 4101759 (1978-07-01), Anthony
patent: 4113547 (1978-09-01), Katz
patent: 4339645 (1982-07-01), Miller

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