Method for heating or cooling wafers

Details Method for heating or cooling wafers Method for heating or cooling wafers

1996-05-28

1998-07-14

Ford, John K.

Heat exchange

With retainer for removable article

165 802, 165 804, 165 805, 156345, 118725, F25B 2900

Patent

active

057789681

ABSTRACT:
Gas-loaded thermal conditioning is used to cause the temperature of a substrate to approach that of a high thermal inertia temperature-controlled plate by adjustable pressure of gas above the substrate, so as to press the substrate against the plate. There is no mechanical contact with the substrate except the plate which it rests on, and there is no danger of overheating or overcooling.

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patent: 5304279 (1994-04-01), Coultas et al.
patent: 5411076 (1995-05-01), Matsunaga et al.

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