Method for heating a patterned substrate

Details Method for heating a patterned substrate Method for heating a patterned substrate

1988-12-23

1990-05-22

Seidel, Richard K.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

2281802, 228222, 228242, B23K 112, B23K 119

Patent

active

049270680

ABSTRACT:
A method for heating a patterned substrate having electronic components, using a heat control mask having plural apertures is disclosed. Heat transfer rates associated with the apertures are determined by thermodynamic analysis based on the discrete two-dimensional heat conduction equation treating heat from the heater as an advection.

REFERENCES:
patent: 3509317 (1970-04-01), Valsamakis et al.
patent: 3588425 (1971-06-01), Erickson
patent: 4698774 (1987-10-01), Abe et al.
patent: 4771929 (1988-09-01), Bahr et al.

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