Method for heat sealing paperboard substrates using a uniform en

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

1562753, 1562757, 156324, 372102, 359566, B32B 3128

Patent

active

057923019

ABSTRACT:
This invention relates to a method and apparatus for heat sealing polymer coated paperboard substrates with light energy. Such structures of this type, generally, use lasers which allow a very accurate placement of the sealing energy and a controllable energy level.

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