Method for hardening a one-package epoxy formulation including p

Details Method for hardening a one-package epoxy formulation including p Method for hardening a one-package epoxy formulation including p

1992-04-06

1993-06-15

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

528 87, 528 93, 528 94, 528111, 528117, 528123, 528407, C08G 5918

Patent

active

052199568

ABSTRACT:
There is disclosed a method for hardening a curable one-package epoxy resin system formed of an epoxy resin and a hardener, which comprises heating the curable one-package epoxy resin system to start the reaction between the epoxy resin and the hardener, and, before the reaction ratio reaches 50%, leaving the curable one-package epoxy resin system to stand at an ambient temperature.

REFERENCES:
patent: 4530991 (1985-07-01), Hirai et al.
patent: 4544733 (1985-10-01), Hirai et al.
patent: 4588617 (1986-05-01), Oka
patent: 4742148 (1988-05-01), Lee et al.
patent: 4797455 (1989-01-01), Lin et al.
patent: 4859761 (1989-08-01), Flury et al.

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