Method for handling semiconductor wafers in a clean room by...

Textiles: weaving – Fabrics – Drier felts

Reexamination Certificate

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Details

C139S42000D, C002S901000, C442S208000

Reexamination Certificate

active

06234214

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the construction of dust proof clothing worn in clean rooms especially in the clean rooms of the semiconductor field, sealed equipment field, medical and pharmaceutical field and food processing fields, etc., where it is necessary to control various dust from a product quality and hygiene perspective.
2. Description of the Related Art
At present, clean rooms are used in various fields. Normally, people engaged in operations in these clean rooms perform their operations wearing special work clothing called dust proof clothing in order to maintain the degree of cleanliness within the room. In recent years, the demand for the level of cleanliness in the clean rooms has increased markedly in a variety of fields.
For example, concerning the clean room of the semiconductor field, in conjunction with the increased level of integration of semiconductor devices, a cleanliness degree equivalent to the United States standard “Class 1” is demanded. This “Class 1” indicates that no more than one particle of dust less than 0.5 &mgr;m is present in 1 cubic foot.
In order to maintain this high level of cleanliness, proposals relating to clean rooms, proposals relating to dust proof clothing, etc., have been made in various fields. For example, as a proposal relating to dust proof clothing, Japanese Laid Open Patent Gazette, Laid Open Patent Hei 3-26535 is known.
Until now, proposed dust proof clothing has not satisfied the extremely high degree of cleanliness demanded for wearing within clean rooms.
SUMMARY OF THE INVENTION
The object of the present invention is to provide an improved method for handling semiconductor wafers in a clean room, which includes wearing dust proof clothing whereby much of the dust attached to the wearer is captured within the dust proof clothing, and it is difficult for dust to adhere to the outside of the dust proof clothing, and which has superior strength.
In order to achieve this object, various embodiments of the invention are shown below.
Dust proof clothing that is worn according to the invention is comprised so that on the inside surface more curved fibers are exposed than linear fibers, and on the outside surface more linear fibers are exposed than curved fibers.
By this construction, there are only a few dust catching spaces on the outside surface compared to the inside surface, and there are a lot of dust catching spaces on the inside surface compared to the outside surface.


REFERENCES:
patent: 5883022 (1999-03-01), Elsener
patent: 5981409 (1999-11-01), Takagi et al.
patent: 5991921 (1999-11-01), Saito
patent: 6034007 (2000-03-01), Tominaga
patent: 1-239172 (1989-09-01), None
patent: 3-26535 (1991-02-01), None
patent: 7-238470 (1995-09-01), None

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