Method for grounding a printed circuit board using a separate me

Details Method for grounding a printed circuit board using a separate me Method for grounding a printed circuit board using a separate me

1997-12-05

1999-09-14

Burr, Edgar

Electrical connectors

With circuit conductors and safety grounding provision

H01R 466

Patent

active

059513071

ABSTRACT:
One embodiment of the present invention provides a method for securing a printed circuit board to a chassis and electrically coupling the printed circuit board to a reference voltage, such as ground. This is accomplished without using screws, and without requiring contacts to be soldered to the printed circuit board. This embodiment includes a chassis, including conductive material at the reference voltage. A mount extends from the chassis and includes a fastener for fastening to the printed circuit board. This embodiment also includes a contact surface on the printed circuit board, for electrically coupling the printed circuit board to the chassis. Additionally, this embodiment includes a contacting element, including an electrically conductive material, which exerts a restoring force when deformed. This contacting element can be located so that it is compressed between the contact surface and the chassis when the printed circuit board is fastened to the mount. When compressed, the contacting element is deformed and exerts a restoring force against the contact surface and the chassis to form a conducting path between the contact surface and the chassis. In a variation on this embodiment, the contacting element includes an opening, through which the mount and fastener extend before the fastener is coupled to the printed circuit board.

REFERENCES:
patent: 5164916 (1992-11-01), Wu et al.
patent: 5647748 (1997-07-01), Mills et al.
patent: 5691504 (1997-11-01), Sands et al.

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