Method for grinding the surface of a semiconductor wafer

Details Method for grinding the surface of a semiconductor wafer Method for grinding the surface of a semiconductor wafer

1983-04-19

1990-08-14

Rose, Robert A.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51325, 125 1101, 125 1119, B24B 100

Patent

active

049475983

ABSTRACT:
A dresser made of bonded alundum-type abrasive is ground by a rotating blade made of bonded super abrasive to dress the blade. The surface of a semiconductor wafer is ground by the rotating dressed blade to convert it into a matte-finished surface substantially free from saw marks.

REFERENCES:
patent: 4226055 (1980-10-01), Komanduri et al.
patent: 4411107 (1983-10-01), Sekiya et al.
"Diamond Wheel Catalog"; Accurate Diamond Tool Corporation, Catalog No. 72.

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