Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2005-10-18
2005-10-18
Wilson, Christian (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S110000, C257S701000, C257S704000
Reexamination Certificate
active
06955950
ABSTRACT:
In a method for generating a protective cover for a device, where a substrate is provided, which comprises the device, first, a sacrificial pattern is generated on the substrate. The sacrificial pattern covers at least an area of the substrate, which comprises the device. Then, a polymer layer is deposited, which comprises at least on sacrificial pattern. Then, an opening will be formed in the polymer layer to expose a portion of the sacrificial pattern. Then, the sacrificial pattern will be removed and the formed opening in the polymer layer is closed.
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Aigner Robert
Franosch Martin
Meckes Andreas
Oppermann Klaus-Günter
Strasser Marc
Infineon - Technologies AG
Maginot Moore & Beck
Wilson Christian
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