Method for forming wiring pattern, wiring pattern, and...

Details Method for forming wiring pattern, wiring pattern, and... Method for forming wiring pattern, wiring pattern, and...

2005-08-04

2009-12-08

Tran, Binh X (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098400, C427S427100, C427S427300

Reexamination Certificate

active

07629019

ABSTRACT:
A method for forming a wiring pattern in which a plurality of electrical wirings deposited onto a substrate is conductively connected with each other through a plurality of conductive posts, the method including relatively moving a discharge head having a plurality of nozzles and a substrate in a predetermined direction while discharging droplets from predetermined nozzles among the plural nozzles to form the plural conductive posts, wherein, in the orthogonal direction of the above-referenced predetermined direction, the interval among the plural nozzles “a” and the interval among the plural conductive posts “b” satisfy an equation “b=m×a” (“m” may be any positive integer).

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