Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Patent
1993-11-12
1995-10-17
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
205118, 205125, 205170, 205221, 205223, 427 96, 427 97, 427 98, C25D 502, C25D 518, C25D 534, C25D 548
Patent
active
054587638
ABSTRACT:
A wiring pattern forming method in which side etch of a wiring pattern at the time of etching the substrate copper foil of a copper plating pattern is reduced to hold down an increase in line resistance, the wiring pattern forming method including the steps of: providing a plating resist pattern of which open area comprises a wiring pattern on the surface of a copper-clad laminate which is obtained by providing a copper foil on an insulating substrate; plating such open area with copper to form a copper plating pattern; then plating a crevice between the copper plating pattern and the plating resist pattern with a solder film by alternately repeating application of a current for a predetermined time period and suspension of the current application for a predetermined time period; and etching away the copper foil by using the solder film as an etching resist to form the wiring pattern.
Akahoshi Haruo
Kobayashi Shiro
Miyazaki Tomoyuki
Takada Toshinari
Yamamoto Kanji
Hitachi , Ltd.
Niebling John
Wong Edna
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