Method for forming via holes in multilayer circuits

Details Method for forming via holes in multilayer circuits Method for forming via holes in multilayer circuits

1993-10-08

1994-03-15

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437173, 437235, 148DIG69, 148DIG93, H01L 2144

Patent

active

052945677

ABSTRACT:
The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.

REFERENCES:
patent: 4806188 (1989-02-01), Rellick
patent: 4965702 (1990-10-01), Lott et al.
patent: 5066357 (1991-11-01), Smyth, Jr. et al.
patent: 5194713 (1993-03-01), Egitto et al.
patent: 5213876 (1993-05-01), Smyth, Jr. et al.
Tessier, T. G., et al. "Compatibility of Common MCM-D Dielectrics with Scanning Laser Ablation Via Generation Processes" 42nd Electronics Components and Tech. Conf., IEEE, 1992, pp. 763-769.
Gower, M. C., et al., "Excimer Laser Projector for Materials Processing Applications", Laser Ablation of Electronic Materials, 1992, pp. 255-262.

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