Etching a substrate: processes – Forming or treating optical article
Patent
1995-06-20
1997-09-02
Dang, Thi
Etching a substrate: processes
Forming or treating optical article
216 49, 216 46, 216 52, 216 74, 65 31, B05D 100, C03C 2500
Patent
active
056628170
ABSTRACT:
The method for forming a tip of an array optical fiber disclosed is one in which an etching resistive material such as a photoresist is applied first on an end portion of a coated material covering constituent fibers of the array optical fiber, and then the ends of the constituent fibers are etched. Due to the presence of the etching resistive material, the etching solution does not dissolve the coated material. In an alternative method, the etching resistive material such as a photoresist is applied on a side surface of a tip portion of each constituent fiber of the array optical fiber exposed from the coated material, the tip portion is cut and flattened together with the etching resistive material, and the end faces of the constituent optical fibers are etched. The presence of the etching resistive material prevents the tip diameter of the constituent optical fiber from becoming small.
REFERENCES:
patent: 5100507 (1992-03-01), Cholewa et al.
patent: 5290398 (1994-03-01), Feldman et al.
patent: 5531343 (1996-07-01), Filas et al.
"Put-in Micro-connectors for Alignment-Free Coupling of Optical Fiber Arrays" by A. Sasaki et al., Fourth Optoelectronics Conference (OEC'92) Technical Digest, pp. 136-137, Jul. 1992.
Dang Thi
NEC Corporation
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