Metal fusion bonding – Process – Plural joints
Patent
1992-10-05
1993-06-22
Rosenbaum, Mark
Metal fusion bonding
Process
Plural joints
228197, B23K 20233, B23K10136, H05K 334
Patent
active
052210383
ABSTRACT:
A solder connection (30) is formed based upon a tinindium or tin-bismuth alloy, but having a melting temperature greater than the melting temperature of the initial solder alloy. A deposit (26) of solder alloy is placed against a tin plate (24) applied, preferably by electrodeposition, to a first faying surface (18). Following assembling with a second faying surface (22), the assembly is heated to melt the solder deposit, whereupon tin from the tin plate dissolves into the solder liquid to form a tin-enriched alloy having an increased melting temperature.
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Melton Cynthia M.
Skipor Andrew
Elpel Jeanne M.
Fekete Douglas D.
Motorola Inc.
Rosenbaum Mark
Southard Donald B.
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