Method for forming thin film and film-forming device

Details Method for forming thin film and film-forming device Method for forming thin film and film-forming device

2011-04-19

2011-04-19

Tadesse, Yewebdar T (Department: 1713)

Coating apparatus

With means to apply electrical and/or radiant energy to work...

Electrostatic and/or electromagnetic attraction or...

C118S634000, C118S052000, C118S612000, C118S319000, C118S320000

Reexamination Certificate

active

07926444

ABSTRACT:
It is an object to provide a method for forming a thin film having a uniform thickness so as to follow asperities of a surface of a wafer to be processed and to provide a film-forming device used for the method. The film-forming device includes a treatment chamber for receiving a wafer and isolating the wafer from the air; a solvent-gas-supplying portion for supplying a solvent gas into the treatment chamber; a chuck for rotatably holding the wafer so that the downward-facing surface of the substrate is the surface on which a thin film is formed; a coating-solution-supplying portion for supplying a coating solution as a mist of charged particles toward the surface of the wafer; and a charging portion for charging the wafer with an electrical potential opposite to the charge of the particles.

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Notice of Grounds of Rejection mailed on Dec. 4, 2009 for priority Japanese Patent Application No. 2005-335247 with English translation.

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