Method for forming thick film resistors and compositions therefo

Details Method for forming thick film resistors and compositions therefo Method for forming thick film resistors and compositions therefo

1993-10-14

1995-10-31

Hoang, Tu

Electrical resistors

With base extending along resistance element

Resistance element coated on base

338 20, 29620, 252518, H01C 1012

Patent

active

054633672

ABSTRACT:
Thick film resistor ink compositions and a method for formulating and processing such inks are provided for producing thick film resistors having highly repeatable and stable resistance characteristics. The inks are specifically formulated to produce resistors whose resistivities are determined in part by the sintering temperature employed in the processing of the resistors. The processing of the inks involves using infrared radiation techniques to rapidly sinter the inks at highly controllable temperatures, so as to enable the resistance of a resistor to be predictably altered by the sintering operation, such that in-process adjustments can be made to the processing method. Thick film resistors produced in accordance with this invention are characterized by high stability to environmental influences and low TCR values on the order of about .+-.50 ppm/.degree.C.

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patent: 5098611 (1992-03-01), Honda et al.
patent: 5379016 (1995-01-01), Smith et al.

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