Method for forming the multi-layer structure of a connection boa

Details Method for forming the multi-layer structure of a connection boa Method for forming the multi-layer structure of a connection boa

1990-07-24

1993-08-03

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156643, 156644, 174258, 205125, H01K 310

Patent

active

052317579

ABSTRACT:
Via studs (23) of the multi-layer structure (12) are formed on a uniform metal layer that is subsequently etched to form the conductors (17) of a conductive layer of the multi-layer structure.

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patent: 4776087 (1988-10-01), Cronin et al.
patent: 4830691 (1989-05-01), Kida et al.
patent: 4963697 (1990-10-01), Peterson et al.
patent: 4984132 (1991-01-01), Sakurai et al.
IBM Technical Disclosure Bulletin, vol. 21, No. 4, Sep. 1978, pp. 1396-1397.
IBM Tech. Discl. Bull., vol. 10, No. 4, Sep. 1967, pp. 359-360 by Peter et al.

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