Method for forming solder bumps on a substrate using an electrod

Details Method for forming solder bumps on a substrate using an electrod Method for forming solder bumps on a substrate using an electrod

1993-12-15

1995-03-14

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

29846, 29884, 29885, 22818022, H05K 334

Patent

active

053967020

ABSTRACT:
Solder bumps are electrodeposited onto a substrate with carefully controlled heights by forming patterned conductors on an substrate, depositing and patterning a layer of material, such as titanium that is easily oxidized, and electrodepositing the solder bumps. The solder does not deposit on the titanium. Solder bumps of uniform height are obtained because the titanium layer acts as part of the electrical circuit during electrodeposition.

REFERENCES:
patent: 3458925 (1969-08-01), Napier et al.
patent: 3716907 (1973-02-01), Anderson
patent: 4950623 (1990-08-01), Dishan
patent: 5130275 (1992-07-01), Dion
patent: 5162257 (1992-11-01), Yung

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