Method for forming silicon oxide layer

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

Reexamination Certificate

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C427S255270, C427S578000

Reexamination Certificate

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06926932

ABSTRACT:
A method for forming a silicon oxide layer in the production of the polysilicon film transistor is disclosed. A plasma surface treatment is performed over a substrate after an amorphous silicon layer has been formed on the substrate by PECVD to transform a portion of the amorphous silicon layer into a superficial oxide layer.

REFERENCES:
patent: 5654203 (1997-08-01), Ohtani et al.
patent: 5691212 (1997-11-01), Tsai et al.
patent: 5989945 (1999-11-01), Yudasaka et al.
patent: 6230650 (2001-05-01), Yamazaki
patent: 6291837 (2001-09-01), Nakajima et al.
patent: 6294219 (2001-09-01), Tsai et al.
patent: 6338874 (2002-01-01), Law et al.
patent: 6358785 (2002-03-01), Chittipeddi et al.

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