Method for forming semiconductor devices

Metal treatment – Compositions – Heat treating

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Details

148186, 148187, H01L 2126

Patent

active

040465950

ABSTRACT:
Disclosed is a manufacturing method for semiconductor devices, which comprises the processes of:

REFERENCES:
patent: RE28653 (1975-12-01), Murphy
patent: 3530343 (1970-09-01), Irie et al.
patent: 3746587 (1973-07-01), Rosvold
patent: 3748187 (1973-07-01), Aubuchon et al.
patent: 3755001 (1973-08-01), Kooi et al.
patent: 3808058 (1974-04-01), Henning

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