Method for forming semiconductor chip and electronic module with

Details Method for forming semiconductor chip and electronic module with Method for forming semiconductor chip and electronic module with

1995-04-10

1997-08-05

Trinh, Michael

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438455, 438386, 438618, 438666, H01L 21283, H01L 21329

Patent

active

056542216

ABSTRACT:
A fabrication method and resultant electronic module having one or more surfaces enhanced with interconnects and components. Electronic modules having, for example, resistors and capacitors integral with a side surface thereof are disclosed. Further described are electronic modules with interconnects electrically attaching for example, side to side, or side to end surfaces are described. Moreover, discussion of an electronic module having a Silicon Front Face chip is contained herein. Specific details of the fabrication method, resulting electronic module, and related wafer processing are set forth.

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patent: 5081063 (1992-01-01), Vonno et al.
patent: 5093708 (1992-03-01), Solomon
patent: 5185292 (1993-02-01), Van Vonno et al.
patent: 5266833 (1993-11-01), Capps
patent: 5275974 (1994-01-01), Ellul et al.
patent: 5517754 (1996-05-01), Beilstein, Jr. et al.

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