Method for forming semiconducting poly(arylene sulfide) surfaces

Details Method for forming semiconducting poly(arylene sulfide) surfaces Method for forming semiconducting poly(arylene sulfide) surfaces

1991-08-30

1993-01-12

Heitbrink, Jill L.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156344, B29K 8100, B29K10304

Patent

active

051787075

ABSTRACT:
A method for coating a poly(arylene sulfide) polymer surface with a semiconductive layer for static charge dissipation and/or induction shielding comprises laminating a poly(arylene sulfide) substrate against a copper foil sheet at a temperature above the melting point of the PAS substrate, wherein the copper foil sheet has been treated with a silane selected from a specific group. When the laminate is cooled and the copper foil peeled away, a poly(arylene sulfide) substrate having a semiconductive surface coating is obtained.

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