Metal working – Method of mechanical manufacture – Electrical device making
Patent
1984-10-23
1987-03-24
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
29847, 174 685, 427 97, H01K 322
Patent
active
046514171
ABSTRACT:
An improved method is disclosed for forming a printed circuit board. The desired printed circuit is established on the surface of a plastic core sheet by placing recesses therein conforming to the desired circuit, and a conductive coating is then applied so that the coating is retained at the recesses. Circuit patterns are preferably pressed into one or both sides of the plastic core sheet, and holes can be placed through the sheet to allow circuit connections between the patterns on the opposite sides of the sheet and to receive electrical leads of circuit components. A thin conductive coating is applied by vacuum deposition, and can be thickness enhanced by electroplating. In addition, multilayered printed circuit boards of more than two layers can be formed by applying one or more laminate sheets of plastic to the surfaces of a core sheet having printed circuits formed thereon, and then pressing circuit patterns into the exposed side of the laminate sheets to form recesses therein, which surfaces then have conductive material applied thereto so that the conductive material is retained at the recesses therein to thus form additional printed circuit board layers.
REFERENCES:
patent: 2772501 (1956-12-01), Malcolm
patent: 2958120 (1960-11-01), Taylor
patent: 3042591 (1962-07-01), Cado
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3606677 (1971-09-01), Ryan
patent: 4075757 (1978-02-01), Malm et al.
patent: 4402998 (1983-09-01), Kumagai et al.
patent: 4517739 (1985-05-01), Lenaerts et al.
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4532152 (1985-07-01), Elarde
Fisher Gene A.
Schumacher, III John E.
Arbes Carl J.
Goldberg Howard N.
Harris Robert E.
New West Technology Corporation
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