Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2006-08-08
2006-08-08
Koehler, Robert R. (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S546000, C428S637000, C428S646000, C428S647000, C428S648000, C428S657000, C428S658000, C428S670000, C428S671000, C428S672000, C428S673000, C428S674000, C428S675000, C428S676000, C428S681000, C428S687000, C428S926000, C205S220000, C205S223000, C205S238000, C205S239000, C205S244000, C205S247000, C205S252000, C205S253000, C205S255000, C205S261000, C205S263000, C205S265000, C205S266000, C205S270000, C205S291000, C205S300000, C205S305000, C205S315000
Reexamination Certificate
active
07087315
ABSTRACT:
A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
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patent: 3446715 (1969-05-01), Frey
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patent: 5700362 (1997-12-01), Yano et al.
patent: 6773828 (2004-08-01), Ooi et al.
patent: 2000-26994 (2000-01-01), None
Ikeda Ryukichi
Matsuo Yoshihiko
Okuda Fumio
Yoshida Kimihiko
Kobe Leadmikk Co., Ltd.
Koehler Robert R.
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
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