Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-12-20
2005-12-20
Hollington, Jermele (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C029S846000
Reexamination Certificate
active
06977515
ABSTRACT:
A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes as one or more masks; a step for fabricating the plurality of probes using the mask; and disposing the plurality of probes through corresponding holes in a first die and a second die. The step for fabricating the plurality of probes may include one of photo-etching and photo-defined electroforming.
REFERENCES:
patent: 3960560 (1976-06-01), Sato
patent: 3966473 (1976-06-01), Sato
patent: 4027935 (1977-06-01), Byrnes et al.
patent: 4451327 (1984-05-01), Nelson
patent: 4466859 (1984-08-01), Nelson
patent: 4520314 (1985-05-01), Asch et al.
patent: 4747907 (1988-05-01), Acocella et al.
patent: 4980638 (1990-12-01), Dermon et al.
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5416429 (1995-05-01), McQuade et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5508144 (1996-04-01), Katz et al.
patent: 5864946 (1999-02-01), Eldridge et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5952843 (1999-09-01), Vinh
patent: 5959461 (1999-09-01), Brown et al.
patent: 6023103 (2000-02-01), Chang et al.
patent: 6031383 (2000-02-01), Streib et al.
patent: 6043563 (2000-03-01), Eldridge et al.
patent: 6124723 (2000-09-01), Costello
patent: 6144212 (2000-11-01), Mizuta
patent: 6150186 (2000-11-01), Chen et al.
patent: 6160412 (2000-12-01), Martel et al.
patent: 6163162 (2000-12-01), Thiessen et al.
patent: 6194127 (2001-02-01), Stolk et al.
patent: 6215321 (2001-04-01), Nakata
patent: 6255602 (2001-07-01), Evans et al.
patent: 6297657 (2001-10-01), Thiessen et al.
patent: 6303262 (2001-10-01), Takaoka et al.
patent: 6330744 (2001-12-01), Doherty et al.
patent: 6334856 (2002-01-01), Allen et al.
patent: 6363605 (2002-04-01), Shih et al.
patent: 6448506 (2002-09-01), Glenn et al.
patent: 6564454 (2003-05-01), Glenn et al.
patent: 6906540 (2005-06-01), McQuade et al.
patent: 1120657 (2001-08-01), None
patent: 03062546 (1991-03-01), None
patent: 6249878 (1994-09-01), None
patent: 2001208772 (2001-08-01), None
patent: WO 01/67116 (2001-09-01), None
Wentworth Laboratories, Inc., Cobra: Vertical Technology Probe Card (2002) (Jun. 7, 2002) at http://www.wentworthlabs.com/product/cobra.htm.
European Search Report and Communication dated Apr. 4, 2003.
Barto Charles L.
McQuade Francis T.
Truckle Phillip M.
Gangerni Anthony P.
Hollington Jermele
Rosenblatt Gregory S.
Wentworth Laboratories Inc.
Wiggin and Dana LLP
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