Method for forming perforations on a printed circuit board

Details Method for forming perforations on a printed circuit board Method for forming perforations on a printed circuit board

1991-06-26

1993-08-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29413, 294261, 29846, H05K 302

Patent

active

052337545

ABSTRACT:
A method for forming perforations on a printed circuit board by means of press-working is disclosed. The perforations are used to facilitate the separation of a mother portion from the supplementary portions of a printed circuit board. The method is characterized in that the surface area of one side or both sides of the printed circuit board to be perforated is coated with copper film prior to the formation of the perforations in order to prevent cracks from forming around the perforations.

REFERENCES:
patent: 4372246 (1983-02-01), Suzuki

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