Method for forming patterned conductive film, electrooptical...

Details Method for forming patterned conductive film, electrooptical... Method for forming patterned conductive film, electrooptical...

2006-09-12

2006-09-12

Schilling, Richard L. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Visible imaging including step of firing or sintering

C430S200000, C430S311000, C430S330000, C430S964000, C438S662000, C438S669000

Reexamination Certificate

active

07105264

ABSTRACT:
Exemplary embodiments of the present invention provide a method to form a patterned conductive film by modifying a conductive thin film on a substrate irrespective of the material used for the substrate. Exemplary embodiments include a substrate having a conductive layer containing a conductive material and a photothermal conversion layer containing a photothermal conversion material that converts light energy into heat energy that is irradiated with a laser beam to fire at least part of the conductive layer with the photothermal conversion material.

REFERENCES:
patent: 4931323 (1990-06-01), Manitt et al.
patent: 4942110 (1990-07-01), Genovese et al.
patent: 5685939 (1997-11-01), Wolk et al.
patent: 2002/0090565 (2002-07-01), Griffith et al.
patent: 2003/0146019 (2003-08-01), Hirai
patent: 2006/0003262 (2006-01-01), Yang et al.
patent: 03262187 (1991-11-01), None
patent: A 5-21387 (1993-01-01), None
patent: A-2003-215816 (2000-07-01), None
patent: A-2001-168061 (2001-06-01), None
patent: 10-0349282 (2001-04-01), None

Affiliated with

Also associated with

Rating

Method for forming patterned conductive film, electrooptical... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming patterned conductive film, electrooptical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming patterned conductive film, electrooptical... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3528696