Method for forming pattern using printing process

Details Method for forming pattern using printing process Method for forming pattern using printing process

2005-04-05

2005-04-05

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S691000, C438S700000, C438S735000, C438S778000, C438S781000, C438S623000, C438S624000

Reexamination Certificate

active

06875704

ABSTRACT:
A method for forming a pattern using a printing process is disclosed in the present invention. The method includes forming a resist layer on a substrate having an etching layer thereon, locating a master having a convex pattern over the substrate, pressing the master against the substrate until the convex pattern of the master directly contacts the etching layer, and removing a portion of the resist layer to expose a surface over the substrate, the removed portion of the resist layer having a width substantially the same as the convex portion of the master.

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