Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-05
1996-11-05
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29830, 29831, 4284735, H01K 322
Patent
active
055705065
ABSTRACT:
Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.
REFERENCES:
patent: 4673773 (1987-06-01), Nakano et al.
patent: 4939039 (1990-07-01), Watanabe
patent: 5072075 (1991-12-01), Lee et al.
IBM Technical Disclosure Bulletin "Multilayer Circuit Board Fabrication", vol. 10, No. 4, Sep. 1967.
Fujisaki Koji
Ikeda Takayoshi
Miwa Takao
Numata Shun-ichi
Okabe Yoshiaki
Hitachi , Ltd.
Nguyen Khan
Vo Peter
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