Method for forming multilayer circuit board

Details Method for forming multilayer circuit board Method for forming multilayer circuit board

2006-10-24

2006-10-24

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S840000, C029S843000, C029S846000, C029S847000, C174S255000

Reexamination Certificate

active

07124503

ABSTRACT:
A method for forming connections within a multi-layer electronic circuit board10which allows for the selective, efficient, and reliable interconnection between at least one conductive layer and a ground plane or layer.

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