Method for forming multi-layer embedded capacitors on a...

Details Method for forming multi-layer embedded capacitors on a... Method for forming multi-layer embedded capacitors on a...

2006-03-10

2008-11-04

Trinh, Minh (Department: 3729)

Metal working

Electric condenser making

Solid dielectric type

C029S846000, C029S852000, C029S025030, C361S301100, C438S381000

Reexamination Certificate

active

07444727

ABSTRACT:
A method for forming embedded capacitors on a printed circuit board is disclosed. The capacitor is formed on the printed circuit board by a depositing a first dielectric layer over one or more electrodes situated on the PCB. Another electrode is formed on top of the first dielectric layer and a second dielectric layer is deposited on top of that electrode. A third electrode is formed on top of the second dielectric layer. The two dielectric layers are abrasively delineated in a single step by a method such as sand blasting to define portions of the first and second dielectric layers to create a multilayer capacitive structure.

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