Method for forming multi-chip sensing device and device formed

Details Method for forming multi-chip sensing device and device formed Method for forming multi-chip sensing device and device formed

1998-08-27

2000-10-24

Fears, Terrell W.

Static information storage and retrieval

Format or disposition of elements

365 52, 257700, G11C 700

Patent

active

061377082

ABSTRACT:
A multi-chip sensing device package and a method for forming such package are disclosed. The multi-chip sensing device package is built on an electrically insulative substrate such as a ceramic material, by using a thick film printing technique to print a multiplicity of bonding pads including interconnection pads and output pads on the surface of the rigid, insulated substrate. After a plurality of sensing elements are bonded by solder to the plurality of bonding pads, the sensing device may be connected to either lead fingers of a lead frame, or to J-leads formed integral with the device for providing electrical communication with an external circuit. The device may further be packaged in a plastic housing with a top surface of the device exposing to the environment for performing its detection function.

REFERENCES:
patent: 6023097 (2000-02-01), Chiang et al.

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