Method for forming microstructures on a substrate using a mold

Details Method for forming microstructures on a substrate using a mold Method for forming microstructures on a substrate using a mold

2006-04-25

2006-04-25

Griffin, Steven P. (Department: 1731)

Plastic and nonmetallic article shaping or treating: processes

Direct application of electrical or wave energy to work

Polymerizing, cross-linking, or curing

C264S259000

Reexamination Certificate

active

07033534

ABSTRACT:
In a method of making a microstructured assembly, a substantially uniform coating of a curable material is formed on a substrate with the coating defining a leading edge. The coating is contacted with a mold starting at the leading edge to form in the curable material a plurality of barrier regions connected by intervening land regions. The curable material is cured and the mold is removed. Optionally, the coating includes a binder. Such a coating can optionally be debinded. In addition, the coating can be fired to form ceramic microstructures.

REFERENCES:
patent: 3689346 (1972-09-01), Rowland
patent: 3811814 (1974-05-01), Earle et al.
patent: 3816043 (1974-06-01), Snelling et al.
patent: 4026714 (1977-05-01), Lewis
patent: 4340276 (1982-07-01), Maffitt et al.
patent: 4536435 (1985-08-01), Utsumi et al.
patent: 4554259 (1985-11-01), Franklin et al.
patent: 4617279 (1986-10-01), Manabe et al.
patent: 4640900 (1987-02-01), Kokubu et al.
patent: 4734143 (1988-03-01), Meoni
patent: 4756856 (1988-07-01), Choinski
patent: 4857420 (1989-08-01), Maricle et al.
patent: 4867935 (1989-09-01), Morrison, Jr.
patent: 4975104 (1990-12-01), Kim
patent: 5004950 (1991-04-01), Lee
patent: 5011391 (1991-04-01), Kawasaki et al.
patent: 5037723 (1991-08-01), Hwang
patent: 5096401 (1992-03-01), Tamura et al.
patent: 5116704 (1992-05-01), Kwon
patent: 5136207 (1992-08-01), Miyake et al.
patent: 5175030 (1992-12-01), Lu et al.
patent: 5183597 (1993-02-01), Lu
patent: 5205770 (1993-04-01), Lowrey et al.
patent: 5209688 (1993-05-01), Nishigaki et al.
patent: 5247227 (1993-09-01), Park
patent: 5268233 (1993-12-01), Heller et al.
patent: 5342563 (1994-08-01), Quinn et al.
patent: 5352478 (1994-10-01), Miyake et al.
patent: 5484314 (1996-01-01), Farnworth
patent: 5509840 (1996-04-01), Huang et al.
patent: 5527624 (1996-06-01), Higgins et al.
patent: 5545670 (1996-08-01), Bissbort et al.
patent: 5581876 (1996-12-01), Prabhu et al.
patent: 5585428 (1996-12-01), Quinn et al.
patent: 5601468 (1997-02-01), Fujii et al.
patent: 5629583 (1997-05-01), Jones et al.
patent: 5658832 (1997-08-01), Bernhardt et al.
patent: 5667418 (1997-09-01), Fahlen et al.
patent: 5672460 (1997-09-01), Katoh et al.
patent: 5703433 (1997-12-01), Fujii et al.
patent: 5707267 (1998-01-01), Hayashi
patent: 5714840 (1998-02-01), Tanabe et al.
patent: 5725407 (1998-03-01), Liu et al.
patent: 5747931 (1998-05-01), Riddle et al.
patent: 5776545 (1998-07-01), Yoshiba et al.
patent: 5840465 (1998-11-01), Kakinuma et al.
patent: 5853446 (1998-12-01), Carre et al.
patent: 5854152 (1998-12-01), Kohli et al.
patent: 5854153 (1998-12-01), Kohli
patent: 5909083 (1999-06-01), Asano et al.
patent: 6008582 (1999-12-01), Asano et al.
patent: 6023130 (2000-02-01), Sakasegawa et al.
patent: 6043604 (2000-03-01), Horiuchi et al.
patent: 6149482 (2000-11-01), Sakasegawa et al.
patent: 6184621 (2001-02-01), Horiuchi et al.
patent: 6220915 (2001-04-01), Radloff
patent: 6247986 (2001-06-01), Chiu et al.
patent: 6306948 (2001-10-01), Yokoyama et al.
patent: 6325610 (2001-12-01), Chiu et al.
patent: 6352763 (2002-03-01), Dillon et al.
patent: 2001/0007682 (2001-07-01), Chiu et al.
patent: 2003/0100192 (2003-05-01), Chiu
patent: 0 802 170 (1997-10-01), None
patent: 0 836 892 (1998-04-01), None
patent: 0 855 731 (1998-07-01), None
patent: 0 866 487 (1998-09-01), None
patent: 0 893 813 (1999-01-01), None
patent: 2 764 438 (1998-11-01), None
patent: 1257621 (1971-12-01), None
patent: 1-137534 (1989-05-01), None
patent: 11-339668 (1989-12-01), None
patent: 3-54569 (1991-03-01), None
patent: 8-273537 (1996-10-01), None
patent: 8-321258 (1996-12-01), None
patent: 9-12336 (1997-01-01), None
patent: 09012336 (1997-01-01), None
patent: 9-134676 (1997-05-01), None
patent: 10-134705 (1997-05-01), None
patent: 9-147754 (1997-06-01), None
patent: 9-283017 (1997-10-01), None
patent: 10-326571 (1998-12-01), None
patent: 11-135025 (1999-05-01), None
patent: 2000-21303 (2000-01-01), None
patent: 2000-340106 (2000-12-01), None
patent: 97/22961 (1997-06-01), None
patent: 99/60446 (1999-11-01), None
patent: 00/39829 (2000-07-01), None
patent: WO 00/39831 (2000-07-01), None
patent: 00/58990 (2000-10-01), None
patent: 01/20636 (2001-03-01), None
patent: WO 01/20636 (2001-03-01), None
patent: WO 01/30723 (2001-05-01), None
patent: 01/52299 (2001-07-01), None
patent: 01/95361 (2001-12-01), None

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