Method for forming micromachined structure

Details Method for forming micromachined structure Method for forming micromachined structure

2006-08-10

2008-12-02

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S119000, C438S048000, C257S225000

Reexamination Certificate

active

07459344

ABSTRACT:
The invention provides a method of fabricating a micromachined structure, and in particular to a method of forming a micro-electro-mechanical system (MEMS) structure. A thin silicon cantilevered or suspended structure used to make micromachined structures is first formed from a SOI wafer or a bulk silicon wafer, followed by formation of the micromachined structures by semiconductor manufacturing techniques.

REFERENCES:
patent: 6221738 (2001-04-01), Sakaguchi et al.
patent: 6743653 (2004-06-01), Tanabe et al.
patent: 2005/0048736 (2005-03-01), Kerdiles et al.

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