Method for forming micro-electro-mechanical system (MEMS)...

Details Method for forming micro-electro-mechanical system (MEMS)... Method for forming micro-electro-mechanical system (MEMS)...

2011-03-21

2011-10-25

Dang, Trung Q (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S416000, C257SE21001

Reexamination Certificate

active

08043897

ABSTRACT:
A method for forming a micro-electro-mechanical systems (MEMS) package includes following steps. A plurality of MEMS units are formed on a substrate, and each of the MEMS units includes at least a MEMS sensing element and a first chamber over the MEMS sensing element. The MEMS units include electric connection pads. A plurality of covering units are formed correspondingly over the MEMS units. Each of the covering units provides a second chamber over the MEMS sensing element opposite to the first chamber. The covering units are adhered to the MEMS units by an adhesive material. The MEMS units are diced into singulated units.

REFERENCES:
patent: 2007/0205492 (2007-09-01), Wang

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