Method for forming metal wires by microdispensing pattern

Details Method for forming metal wires by microdispensing pattern Method for forming metal wires by microdispensing pattern

2008-05-06

2008-05-06

Chang, Rick K. (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C427S304000, C427S305000, C427S306000

Reexamination Certificate

active

10864331

ABSTRACT:
A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.

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