Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-05-06
2008-05-06
Chang, Rick K. (Department: 3726)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C427S304000, C427S305000, C427S306000
Reexamination Certificate
active
07367118
ABSTRACT:
A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.
REFERENCES:
patent: 4668532 (1987-05-01), Moisan et al.
patent: 4888209 (1989-12-01), Neely
patent: 5132248 (1992-07-01), Drummond et al.
patent: 5831070 (1998-11-01), Pease et al.
patent: 6521285 (2003-02-01), Biebuyck et al.
patent: 7112361 (2006-09-01), Lynn et al.
patent: 119879 (1996-04-01), None
patent: 1459824 (2003-12-01), None
patent: 10-150278 (1998-06-01), None
Chang Jane
Cheng Kevin
Chiu Wan-Wen
Yang Ming-Huan
Birch & Stewart Kolasch & Birch, LLP
Chang Rick K.
Industrial Technology Research Institute
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