Method for forming low contact resistance bonding pad

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole

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216 75, 216 77, 216 78, 438706, H01L 2100

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058242341

ABSTRACT:
The present invention provides a method for forming a bonding pad having a low contact resistance. The method includes steps of: a) forming a bonding pad structure on a substrate having a metal layer by forming a passivation layer over said metal layer and etching the passivation layer with a fluorine-containing gas by which a fluorine-containing layer is formed on a surface of said bonding pad structure; and b) removing the fluorine-containing layer for reducing a contact resistance of said bonding pad structure.

REFERENCES:
patent: 5433823 (1995-07-01), Cain

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